Polishing pad assembling device

• Main Authors: ZHANG JIEXUAN, GAO XIANG
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2022
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The polishing pad assembling device comprises a base and an alignment part, the base is provided with a fixing area used for fixing a polishing disc, the alignment part is located on the edge of the fixing area, the alignment part is provided with a connecting part and an alignment part which are fixedly connected together, and the connecting part is fixed to the base; the alignment part is a reference object for alignment of the polishing pad and the polishing disc, the pasting position of the polishing pad is determined through the alignment part, and the situation that the polishing pad is prone to being damaged in the using process, the polishing effect on a wafer is poor, and even the wafer is damaged due to the fact that the polishing pad is pasted obliquely in the pasting process is avoided. The service life of the polishing pad is prolonged, and the polishing effect is improved. 本申请实施例提供的一种抛光垫的装配装置，包括底座以及对准件，底座具有用于固定抛光盘的固定区域，对准件位于固定区域的边缘，对准件具有固定连接在一起的连接部和对准部，连接部固定在底座上，对准部为抛光垫与抛光盘对准的参照物，通过对准件确定抛光垫的粘贴位置