Ceramic metal packaging shell for integrated circuit

• Main Authors: ZHA LIUHUA, NIE QINGHUI, XING FENG
• Format: Patent
• Language: Chinese; English
• Published: 15.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a ceramic metal packaging shell for an integrated circuit. The packaging box comprises a bottom plate and a packaging top shell, fixing plates are installed at the bottom of the bottom plate through bolts, a transverse plate is welded between the inner sides of the fixing plates, a connecting plate is arranged in the transverse plate in a sliding mode, transverse strips are welded to the two ends of the connecting plate, the transverse strips are located on the two sides of the transverse plate, and the transverse strips are located between the transverse plates. A worker can firstly place the integrated circuit in the packaging bottom shell and fixedly connect the integrated circuit with the inner ends of the pins, then the elastic bands are stretched, the fixing pieces at the bottom ends of the elastic bands can be smoothly hung on the connecting plate, the fixing plate can fix the transverse plate, the transverse plate limits the connecting plate, and therefore the integrated ci