High-performance vapor chamber
The utility model relates to the field of heat conduction, in particular to a high-performance uniform temperature plate. Comprising a heat dissipation plate (1) which is vertically combined to form a heat dissipation cavity, a connecting neck (2) is arranged at the end of the heat dissipation plate...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
18.01.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model relates to the field of heat conduction, in particular to a high-performance uniform temperature plate. Comprising a heat dissipation plate (1) which is vertically combined to form a heat dissipation cavity, a connecting neck (2) is arranged at the end of the heat dissipation plate (1), a groove is formed in the connecting neck (2) to form a degassing port (4), and the degassing port (4) is communicated with the heat dissipation cavity; the end part of the connecting neck (2) is also connected with an extension wing (3), the extension wing (3) is provided with a groove to form a degassing outer port (5), and the degassing outer port (5) is communicated with the degassing port (4); the diameter of the degassing outer opening (5) is larger than that of the degassing opening (4); and the width of the extension wing (3) is greater than that of the connecting neck (2). According to the utility model, the extension diameter of the degassing port is increased, the extension width of the connecting |
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Bibliography: | Application Number: CN202122091678U |