High-precision, high-performance and high-heat-dissipation ceramic plate IGBT packaging circuit board

• Main Author: JI ZHIFENG
• Format: Patent
• Language: Chinese; English
• Published: 11.01.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The utility model discloses a high-precision high-performance high-heat-dissipation ceramic plate IGBT packaging circuit board, which comprises a circuit board main body and bolts, the top of the circuit board main body is provided with a mounting frame, and a sealing ring is clamped between the circuit board main body and the mounting frame. And the circuit board main body, the mounting frame and the sealing ring are provided with hole sites which are coaxially aligned and have the same size. According to the high-precision, high-performance and high-heat-dissipation ceramic plate IGBT packaging circuit board, the protective cover covers the circuit board main body, so that fine particulate matters such as dust in an external environment are prevented from being in contact with elements installed on the circuit board main body, dustproof and waterproof protection can be provided for the elements installed on the circuit board main body, and in the protective cover structure, the protection effect is good. Th