Heat dissipation structure of 5G communication circuit board

• Main Authors: ZHANG XIAOBIN, XIAO XUEHUI, OUYANG XIAOJUN
• Format: Patent
• Language: Chinese; English
• Published: 07.01.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a heat dissipation structure of a 5G communication circuit board, which comprises a circuit board body, the circuit board body is composed of a core board, a strength layer, an aluminum oxide heat dissipation coating and a heat conduction layer, the strength layer, the aluminum oxide heat dissipation coating and the heat conduction layer are respectively and symmetrically arranged on the core board from inside to outside, and the strength layer, the aluminum oxide heat dissipation coating and the heat conduction layer are arranged on the core board from inside to outside. The strength layers are symmetrically arranged at the top end and the bottom end of the core plate, and the aluminum oxide heat dissipation coatings are arranged on the side faces, away from each other, of the strength layers. The circuit board has the advantages that the transverse spring pieces and the vertical spring pieces play a role in comprehensively and effectively damping the upper portion and the lower p