Evaporation device and evaporation equipment

• Main Authors: ZHAO LI, XU SAISAI, LU YANCHUN, SUN YUQUN, SUN JUNQI, LIU FANGJUN
• Format: Patent
• Language: Chinese; English
• Published: 07.01.2022
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The embodiment of the invention discloses an evaporation device and evaporation equipment. The evaporation device is used for carrying out evaporation on a wafer, and the evaporation device comprises an evaporation cavity, an evaporation source, a planet pot and a center pot. The evaporation source is arranged at the bottom of the evaporation cavity; the planetary pots are used for placing a first wafer, the number of the planetary pots is multiple, and the multiple planetary pots are arranged above the evaporation source; wherein the multiple planet pots revolve around a vertical line, and the vertical line penetrates through the evaporation source; and the central pot is used for placing a second wafer, the central pot is arranged above the evaporation source, and the vertical line penetrates through the central pot. According to the evaporation device provided by the embodiment of the invention, the center pot is arranged at the upper part of the evaporation cavity, so that the utilization rate of an evapo