Vibration blanking device capable of adjusting silicon wafer cutting edge material

• Main Authors: YANG ZEMING, WANG QIAOFENG, LIU LANYUN, YU YI
• Format: Patent
• Language: Chinese; English
• Published: 04.01.2022
• Subjects: PERFORMING OPERATIONS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The utility model relates to the technical field of blanking, in particular to a vibrating blanking device with a function of adjusting silicon wafer cutting edge materials, which comprises a machine body, the machine body comprises a blanking bin, the bottom end of the blanking bin is fixedly connected with a support frame, the inner side of the blanking bin is slidably connected with an upper filter plate, and the inner side of the blanking bin is connected with a lower filter plate; and the adjusting mechanism comprises a discharging plate, the surface of the discharging plate is connected with an adjusting plate, the surface of the adjusting plate is sleeved with a gear ring, the surface of the gear ring is sleeved with a rotating rod, and the surface of the rotating rod is sleeved with a fixing sleeve. Through rotation of the rotating rod, the gear ring can conveniently drive the adjusting plate to rotate in the discharging bin, through staggered connection between the discharging ports, the discharging