Wafer positioning device based on laser sensor

• Main Authors: KE SHUN, CHEN ZUWANG, KE MENG
• Format: Patent
• Language: Chinese; English
• Published: 28.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a wafer positioning device based on a laser sensor, and relates to the technical field of positioning devices. The device comprises lifting equipment, a supporting plate is assembled on one side of the lifting equipment, laser equipment is assembled on one side of the supporting plate, a crystal box is assembled on the upper surface of the lifting equipment, and wafers are placed in the crystal box. When the wafer positioning device is used, a first bevel gear sleeving the outer surface of a rotating rod rotates by rotating the rotating rod, so that a second bevel gear meshed with the first bevel gear drives a connecting rod to rotate, bidirectional threaded rods on the two sides of the connecting rod rotate, and then two sets of U-shaped plates move; the positioning block is clamped in the positioning groove in the crystal box, so that the crystal box does not move on the upper surface of the fixed seat, and the wafer is prevented from sliding out of the wafer box to be damaged. 本