Cooling system for electronic device

• Main Authors: WANG DEQUAN, CHEN YANGUI, CHEN YIJIE, WU YUEZHANG
• Format: Patent
• Language: Chinese; English
• Published: 14.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A cooling system for an electronic device is provided. The cooling system comprises a central processing unit, a remote radiator and a heat pipe module. The central processing unit is installed on a base of the electronic device. The remote radiator receives heat generated by the central processor....