Cooling system for electronic device

• Main Authors: WANG DEQUAN, CHEN YANGUI, CHEN YIJIE, WU YUEZHANG
• Format: Patent
• Language: Chinese; English
• Published: 14.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A cooling system for an electronic device is provided. The cooling system comprises a central processing unit, a remote radiator and a heat pipe module. The central processing unit is installed on a base of the electronic device. The remote radiator receives heat generated by the central processor. The heat pipe module has a plurality of heat pipes for transferring heat generated by the central processing unit to the remote heat sink, each of the heat pipes having a circular cross-section extending between a first end having a flat non-circular shape and a second end coupled to the base proximate the central processing unit, the first end having a flat non-circular shape, and the second end having a flat non-circular shape. The second end is coupled to a remote heat sink, and the first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe. 一种用于一电子装置的冷却系统。冷却系统包括一中央处理器、一远程散热器以及一热管模块。中央处理器安装在电子装置的一基座上。远程散热器接收中央处理器产生的热量。热管模块具有多个热管，热管用于将中央处理器产生的热量传递至远程散热器，热管中的每个热管具有在一第