Lead frame unit and lead frame

• Main Authors: ZHAO JIALI, WANG JIADA, YANG YUANJIE
• Format: Patent
• Language: Chinese; English
• Published: 23.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of chip packaging, and discloses a lead frame unit and a lead frame, the lead frame unit comprises a bottom film, a connecting frame, pins and a chip seat, the bottom film is arranged at the lower end of the connecting frame, and the pins and the chip seat are arranged in the connecting frame and located at the upper side of the bottom film; the pin comprises a head part and a tail part, symmetrical V-shaped grooves are formed in two side edges, perpendicular to the first side edge, of the head part, and the tail part of the pin is connected with the connecting frame. A chip seat is arranged between the pin of the first side edge and the pin of the second side edge, and the chip seat is connected with the connecting frame through a connecting rod. The lead frame includes a plurality of lead frame units. The two sides of the head of the pin are provided with the V-shaped grooves, so that auxiliary positioning can be carried out on welding spots on the pin in the