Packaging adhesive film with sunken structure

• Main Authors: WANG LEI, HAN XIAOHANG, WU XIAOPING, YU HAOCHEN, ZHENG YA, CHEN HONGYE
• Format: Patent
• Language: Chinese; English
• Published: 05.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a packaging adhesive film with a recessed structure. A plurality of concave structures which are arranged in parallel are arranged on the surface of at least one face of the packaging adhesive film at intervals, each concave structure comprises a bottom face and a side face used for connecting the bottom face and a main body face of the packaging adhesive film, the bottom face and the main body face are arranged in parallel, and a frosted layer is arranged on the bottom face. According to the packaging adhesive film with the concave structure, the problem of breakage of a battery piece with an imbricate structure is effectively avoided. 本实用新型公开了一种具有凹陷结构的封装胶膜。所述封装胶膜的至少一面的表面间隔设置有平行排列的若干凹陷结构，所述凹陷结构包括底面和用于连接所述底面与封装胶膜的主体面的侧面，所述底面与所述主体面平行设置，所述底面上设置有磨砂层。本实用新型的具有凹陷结构的封装胶膜，有效避免了叠瓦结构的电池片的破裂问题。