Equipment for angle polishing of silicon wafer sample

• Main Authors: JIN XUANZHU, WU YONGLIN
• Format: Patent
• Language: Chinese; English
• Published: 25.05.2021
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MEASURING; PERFORMING OPERATIONS; PHYSICS; POLISHING; TESTING; TRANSPORTING

The embodiment of the utility model discloses a device for angle polishing of a silicon wafer sample. The device comprises a polishing plate, a plurality of angle polishing devices and a plurality of angle polishing devices, wherein the polishing plate is provided with a polishing surface for polishing the silicon wafer sample; the clamp is arranged on the polishing surface of the polishing plate and is used for clamping the silicon wafer sample; a motor fixedly disposed relative to the polishing plate; and the connecting mechanism is connected with an output shaft of the motor and the clamp, and the connecting mechanism is configured to enable the clamp to move away from the motor towards the polishing surface of the polishing plate while being driven by the motor to rotate. 本实用新型实施例公开了一种用于角抛光硅片样品的设备，所述设备包括：具有用于抛光所述硅片样品的抛光面的抛光板；设置在所述抛光板的抛光面上的用于夹持所述硅片样品的夹具；相对于所述抛光板固定地设置的马达；连接所述马达的输出轴与所述夹具的连接机构，所述连接机构构造成使得所述夹具能够由所述马达驱动进行旋转的同时能够远离所述马达朝向所述抛光板的抛光面移动。