An electroplating environment for circular electroplating of cylinder body forms tool

• Main Authors: NIE JIN, WEN JIAYONG, HE CHAO, HE JUN
• Format: Patent
• Language: Chinese; English
• Published: 26.01.2021
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The utility model discloses an electroplating environment forming tool for circular electroplating of a cylinder body, which comprises a mounting frame assembly, a mounting auxiliary assembly and a flow guide mounting assembly, and the mounting frame assembly comprises a fixing frame and a pressing assembly; the fixing frame comprises a bottom plate and a frame fixed to the bottom plate. The mounting auxiliary assembly is used for mounting a workpiece, is mounted on the bottom plate after being compensated in height and diameter and is tightly pressed through the pressing assembly, and the mounting auxiliary assembly is further used for guiding electroplating liquid into the cylinder body and enabling an electroplating environment to be formed between the anode and the workpiece through the anode; the flow guide mounting assembly is used for mounting an anode and guiding the electroplating liquid to the electroplating environment; the electroplating device forms a unique and simple electroplating environment,