Full-automatic film sticking machine for wafers

• Main Authors: PENG WENXUE, ZHENG ZHENPING, LIU XIUDONG, SHEN HOUQING, ZHONG XIANQING
• Format: Patent
• Language: Chinese; English
• Published: 05.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of wafer processing accessory devices, in particular to a full-automatic film sticking machine for a wafer, which realizes full-automatic film stickingand improves the film sticking efficiency and quality. The device comprises a rack, the left side of the rack is provided with a wafer positioning mechanism and a wafer lifting mechanism, the wafer positioning mechanism is provided with a wafer carrier used for placing a wafer, the wafer lifting mechanism is located in front of the wafer positioning mechanism, and the right side of the rack is provided with an adsorption positioning mechanism, a rotary die cutting mechanism, a wafer transfer mechanism and a film feeding mechanism. 本实用新型涉及晶圆加工附属装置的技术领域，特别是涉及晶圆全自动贴膜机，实现全自动化贴膜，提高贴膜效率和质量；包括机架，机架左侧设置有晶圆定位机构和晶圆托举机构，晶圆定位机构处设置有用于放置晶圆的晶圆载具，晶圆托举机构处于晶圆定位机构的前方，机架右侧设置有吸附定位机构、旋转模切机构、晶圆移载机构以及送膜机构。