Full-automatic film sticking machine for wafers
The utility model relates to the technical field of wafer processing accessory devices, in particular to a full-automatic film sticking machine for a wafer, which realizes full-automatic film stickingand improves the film sticking efficiency and quality. The device comprises a rack, the left side of...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
05.01.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model relates to the technical field of wafer processing accessory devices, in particular to a full-automatic film sticking machine for a wafer, which realizes full-automatic film stickingand improves the film sticking efficiency and quality. The device comprises a rack, the left side of the rack is provided with a wafer positioning mechanism and a wafer lifting mechanism, the wafer positioning mechanism is provided with a wafer carrier used for placing a wafer, the wafer lifting mechanism is located in front of the wafer positioning mechanism, and the right side of the rack is provided with an adsorption positioning mechanism, a rotary die cutting mechanism, a wafer transfer mechanism and a film feeding mechanism.
本实用新型涉及晶圆加工附属装置的技术领域,特别是涉及晶圆全自动贴膜机,实现全自动化贴膜,提高贴膜效率和质量;包括机架,机架左侧设置有晶圆定位机构和晶圆托举机构,晶圆定位机构处设置有用于放置晶圆的晶圆载具,晶圆托举机构处于晶圆定位机构的前方,机架右侧设置有吸附定位机构、旋转模切机构、晶圆移载机构以及送膜机构。 |
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Bibliography: | Application Number: CN202022351139U |