A substrate including silver surface protected from fading is provided

• Main Authors: SPASSOV VLADISLAV, MANASTERSKI CHRISTIAN, FAURE CEDRIC
• Format: Patent
• Language: Chinese; English
• Published: 22.12.2020
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model relates to a base material (1), which comprises a final silver surface, the final silver surface is used for preventing silver fading through a protective layer (4), and the protective layer has a thickness between 1nm and 200nm. The protective layer (4) comprises a first Al2O3 layer (4a) disposed on the final silver surface and having a thickness between 0.5 nm and 100 nm, the protective layer further comprising a second TiO2 layer (4b) on the first Al2O3 layer (4a), the second TiO2 layer having a thickness between 0.5 nm and 100 nm. 本实用新型涉及一种基材(1)，它包括最终银表面，该最终银表面通过保护层(4)来防止银褪色，该保护层具有介于1nm和200nm之间的厚度。所述保护层(4)包括第一Al2O3层(4a)，该第一Al2O3层设置在所述最终银表面上并且具有介于0.5nm和100nm之间的厚度，所述保护层还包括在该第一Al2O3层(4a)上的第二TiO2层(4b)，该第二TiO2层具有介于0.5nm和100nm之间的厚度。