Pulse width modulation power amplifier of integrated thick film circuit
The utility model discloses a pulse width modulation power amplifier of an integrated thick film circuit, which particularly relates to the technical field of power amplifiers and comprises a shell, aceramic plate installed through screws is arranged in the shell, and the thick film circuit and the...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
18.12.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a pulse width modulation power amplifier of an integrated thick film circuit, which particularly relates to the technical field of power amplifiers and comprises a shell, aceramic plate installed through screws is arranged in the shell, and the thick film circuit and the power amplifier are installed on the ceramic plate. A layer of slurry film covers the surfaces of the ceramic plate, the thick film circuit and the power amplifier, a circle of isolation baffle fixed to the surface of the ceramic plate is arranged on the outer side of the thick film circuit and theouter side of the power amplifier, a gap is reserved between the ceramic plate and the bottom of the shell, and a heat conduction mechanism is arranged in the gap. According to the utility model, thepower amplifier and the thick-film circuit can effectively conduct heat generated by the power amplifier and the thick-film circuit while increasing the power, and effective protection is provided when the difference between a |
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Bibliography: | Application Number: CN202021268404U |