Component carrier

• Main Author: GROBER GERNOT
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present utility model relates to a component carrier, comprising: an electrically insulating layer structure having a first main surface and a second main surface; a via between the first main surface and the second main surface, the via extending through the electrically insulating layer structure; and an integral conductive structure covering sidewalls of the vias, extending to one or both of the major surfaces, and covering at least a portion of the major surfaces of the electrically insulating layer structure. 部件承载件，其中，所述部件承载件包括：电绝缘层结构，所述电绝缘层结构具有第一主表面和第二主表面；通孔，所述通孔位于所述第一主表面和所述第二主表面之间、延伸穿过所述电绝缘层结构；以及整体导电结构，所述整体导电结构覆盖所述通孔的侧壁，延伸直至所述主表面中的一个或两个主表面，并且覆盖所述电绝缘层结构的所述主表面的至少一部分。