CEM-3 copper-clad plate easy to dissipate heat

• Main Authors: XIONG ZUDI, XU XIU, ZHENG ZHE, CHEN YAJUN, CAO TIANLIN, YAN JIANSHENG
• Format: Patent
• Language: Chinese; English
• Published: 17.11.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a CEM3 copper-clad plate easy to dissipate heat, which comprises a substrate, a heat collecting plate is bonded on the upper surface of the substrate through a first bonding layer, an insulating heat conducting layer is arranged on the upper surface of the heat collecting plate, a copper foil layer is arranged on the upper surface of the insulating heat conducting layer, and a plurality of heat conducting columns in contact with the heat collecting plate are embedded in the substrate. The bottom end of the heat conduction column extends out of the base plate body, aheat dissipation plate is bonded to the bottom face of the base plate through a second bonding layer, a plurality of vertically-downward heat dissipation fins are arranged at the bottom of the heat dissipation plate, and first heat dissipation through holes which are transversely formed and penetrate through the two ends of the base plate are formed in the base plate. The heat dissipation fins comprise a plurality of hea