Mounting structure of heat dissipation assembly and terminal

• Main Author: QIN XILI
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TELEPHONIC COMMUNICATION

The application relates to a mounting structure of a heat dissipation assembly and a terminal, the mounting structure of the heat dissipation assembly comprises a terminal front shell and the heat dissipation assembly, the heat dissipation assembly comprises a base and a heat dissipation piece arranged on the base, the periphery of the base of the terminal front shell is provided with an opening,the base is provided with an extension part at a position corresponding to the opening, and the extension part is bent after penetrating through the opening. Therefore, the heat dissipation assembly is fixed on the terminal front shell. According to the utility model, the bonding strength of the terminal front shell and the heat dissipation assembly is improved, and the defect that the heat dissipation assembly and the terminal are bonded by glue is avoided. 本申请涉及一种散热组件的安装结构和终端，散热组件的安装结构包括终端前壳与散热组件，散热组件包括底座与设置在底座上的散热件，终端前壳在底座的周围设有开孔，底座在与开孔对应的位置设有延长部，延长部穿过开孔后弯折，以将散热组件固定在终端前壳上。本实用新型增加了终端前壳和散热组件的结合强度，避免了散热组件与终端用胶粘结的缺陷。