Half-bridge rectification device

The utility model discloses a half-bridge rectifying device which comprises two diode chips, a metal base, a first lead frame and a second lead frame, and an epoxy packaging layer is wrapped on the two diode chips, the metal base, the first lead frame and the second lead frame. Each of the first lea...

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Bibliographic Details
Main Authors LIAO BING, SHEN LIFU
Format Patent
LanguageChinese
English
Published 03.11.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a half-bridge rectifying device which comprises two diode chips, a metal base, a first lead frame and a second lead frame, and an epoxy packaging layer is wrapped on the two diode chips, the metal base, the first lead frame and the second lead frame. Each of the first lead frame and the second lead frame further comprises a transverse metal plate, vertical metal plateslocated at the two ends of the transverse metal plate respectively and a welding protruding part protruding downwards and outwards, and the transverse metal plates of the first lead frame and the second lead frame are located above the two diode chips respectively. The vertical metal plates of the first lead frame and the second lead frame are symmetrically arranged on the two sides of the two diode chips respectively. And the welding convex parts of the first lead frame and the second lead frame are respectively and electrically connected with the other ends of the two diode chips with the same polarity through solde
Bibliography:Application Number: CN202020841484U