Module structure with heat dissipation inclined plane and subarray module

• Main Authors: FU BO, ZHANG LIDAN, XIA HUI, FENG LIN, XUE WEI, ZHOU PEIHAN
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2020
• Subjects: ANALOGOUS ARRANGEMENTS USING OTHER WAVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; PHYSICS; PRINTED CIRCUITS; RADIO DIRECTION-FINDING; RADIO NAVIGATION; TESTING

The utility model relates to the field of module heat radiation, in particular to a module structure with a heat radiation inclined plane and a subarray module, the module structure comprises a firstcavity and a second cavity, the first cavity is provided with a groove, at least one bonding surface exists between the second cavity and the groove, the bonding surface is arranged in an inclined manner, and the subarray module is arranged in the groove. According to the sub-array module, the attaching faces of the first cavity and the second cavity are obliquely arranged, the contact area between the first cavity and the second cavity is increased, the area of the heat conduction and heat dissipation face between the first cavity and the second cavity is large, and the overall heat dissipation effect of the module structure is improved. And the overall heat dissipation effect is good, and the LED lamp can adapt to design and application of different types of small-sized and large-power products. 本实用新型涉及模块散热领域，特别