Chip switching structure

• Main Authors: WEI CHUIYA, ZHOU TIANFEI, SHAO JIANG, LI GUANGHUI, CHEN CANCAN, XU YONGMIN
• Format: Patent
• Language: Chinese; English
• Published: 28.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of chip electrical property testing, in particular to a chip switching structure, which comprises a rubber layer, an insulating layer, an insulating layer, an insulating layer and a plurality of conductive terminals, wherein a high-density gold wire i...