Chip switching structure

• Main Authors: WEI CHUIYA, ZHOU TIANFEI, SHAO JIANG, LI GUANGHUI, CHEN CANCAN, XU YONGMIN
• Format: Patent
• Language: Chinese; English
• Published: 28.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to the technical field of chip electrical property testing, in particular to a chip switching structure, which comprises a rubber layer, an insulating layer, an insulating layer, an insulating layer and a plurality of conductive terminals, wherein a high-density gold wire is embedded in the rubber layer for leading out a signal; the substrate layer is connected with the rubber layer, is positioned on the lower surface of the rubber layer and is used for receiving the signal; the printed circuit board layer is located on the lower surface of the substrate layer, and the substrate layer is welded to the printed circuit board layer and used for leading out the signals received by the substrate layer and being connected to an instrument or an automatic device in an extended mode. According to the utility model, the chip solder ball or the gasket is contacted with the gold wire on the surface of the rubber layer to lead out a signal, the positioning problem of thechip and the switching st