Spray treatment device

In order to improve the quality of a substrate, a processing liquid is removed from the upper surface of the substrate by suction, so that the processing is uniform, and the components of the processing liquid in a supply tank are homogenized with high efficiency. The supply tank (13) of the process...

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Bibliographic Details
Main Authors KATANIWA TETSUYA, AKIYAMA MASANORI
Format Patent
LanguageChinese
English
Published 30.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In order to improve the quality of a substrate, a processing liquid is removed from the upper surface of the substrate by suction, so that the processing is uniform, and the components of the processing liquid in a supply tank are homogenized with high efficiency. The supply tank (13) of the processing unit (10B) is connected to a liquid delivery passage (54A) for delivering the processing liquidfrom the supply tank (13) of the processing unit (10B) to the supply tank (13) of the processing unit (10A). A liquid delivery pump (53) and an ejector (52) are provided in the liquid delivery passage(54A). The liquid delivery pump (53) delivers the processing liquid (5) from the processing unit (10B) side to the processing unit (10A) side. The ejector (52) has a venturi and communicates with a suction mechanism (50) of the processing unit (10A). The suction-side tip of the ejector (52) is a negative pressure required for the suction action achieved by the suction mechanism (50) of the processing unit (10A). 一种喷雾处理装置，
Bibliography:Application Number: CN201921562075U