Silicon-based miniature LED chip

• Main Authors: XU LIANG, LEI ZIHE
• Format: Patent
• Language: Chinese; English
• Published: 19.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a silicon-based miniature LED chip, which comprises a silicon substrate, a plurality of light-emitting structures, cutting grooves and an organic insulating layer, and thecutting grooves are arranged among the light-emitting structures. According to the utility model, the silicon substrate is adopted to replace a sapphire substrate, so that the damage to the gallium nitride material and the micro LED chip caused by N2 generated by decomposition after gallium nitride absorbs laser during laser lift-off of the sapphire substrate is avoided. Besides, the silicon substrate is removed through a two-step method of physical grinding and chemical corrosion so that the light-emitting structure can be protected from being damaged while the silicon substrate is effectively removed, and the removal yield and reliability of the substrate can be enhanced. 本实用新型公开了一种硅基微型LED芯片，包括硅衬底、若干个发光结构、切割槽和有机绝缘层，所述切割槽设置在发光结构之间。本实用新型采用硅衬底来代替蓝宝石衬底，避免了蓝宝石衬底在激光剥离时因为氮化镓吸收激光后分解产生的N对氮化镓材料和微型LED芯片所造成的破坏。此外，本实用新型通过物理研