Laser cutting mechanism of assembly line for wire harness processing

• Main Author: SONG YAZHOU
• Format: Patent
• Language: Chinese; English
• Published: 19.06.2020
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model relates to a laser cutting mechanism of an assembly line for wire harness processing, which comprises a transmission line, a laser cutting mechanism and a laser cutting mechanism, wherein the carrier is arranged on the transmission line, and a jig for loading a wire harness is arranged on the carrier; the blocking mechanism is positioned on the transmission line; a stopper is also arranged at the rear end of the stopping mechanism on the transmission line; the laser jacking cylinder is arranged on the synchronous belt below the transmission line, and the synchronous belt is driven by a motor; a jacking sensor is arranged on one side of the laser jacking cylinder; a positioning plate is arranged at the top of the laser jacking air cylinder, and jacking pieces correspondingto the jacking holes in the two ends of the bottom of the jig are arranged on the positioning plate; according to the wire harness laser cutting device, laser cutting machining of the two ends of thewire harness can be autom