Pin cleaning tool for semiconductor tape packaging test
The utility model provides a pin cleaning tool for a semiconductor tape packaging test. The needle cleaning device comprises a needle cleaning part and a holding part, the needle cleaning part is fixed to one end of the holding part, the holding part comprises a clamping plate, a connecting plate an...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
05.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides a pin cleaning tool for a semiconductor tape packaging test. The needle cleaning device comprises a needle cleaning part and a holding part, the needle cleaning part is fixed to one end of the holding part, the holding part comprises a clamping plate, a connecting plate and a handle, the clamping plate is fixedly connected with one end of the connecting plate, the otherend of the connecting plate is fixedly connected with the handle, and the needle cleaning part is clamped in the clamping plate. Due to the arrangement of the holding part, a person can conveniently hold the cleaning needle, and needle bending caused by direct pressing of abrasive paper when the person grinds the needle is avoided.
本实用新型提供了一种半导体卷带封装测试用清针工装,包括清针部件和握持部件,所述清针部件固定在握持部件一端,所述握持部件包括夹板、连接板和把手,所述夹板与连接板的一端固定连接,所述连接板另一端与把手固定连接,所述清针部件夹持在夹板内。本实用新型通过设置握持部件,方便人员握持清针,避免了人员磨针时直接按压砂纸造成针弯。 |
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Bibliography: | Application Number: CN201922061544U |