Headband structure of headset

• Main Authors: ZENG QIMING, LIN JINZHONG
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2020
• Subjects: DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; PUBLIC ADDRESS SYSTEMS

The utility model discloses a headband structure of a headphone. The utility model discloses a telescopic adjusting device, which comprises a telescopic adjusting module, the telescopic adjusting module comprises an upper cover, a sliding sheet, an elastic sheet and a lower cover, the elastic sheet is arranged at one end of the lower cover, the upper cover is arranged above the lower cover, the sliding sheet is placed between the upper cover and the lower cover, and the elastic sheet is provided with a convex surface; head band group, the connecting module is connected with one end of the telescopic adjusting module; the head band comprises a head band body and two end covers, the end covers are arranged at the left end and the right end of the head band body, a space is formed between theend covers and the head band body, one end of the telescopic adjusting module is located in the space, a wave-shaped buckling position is arranged on the inward inner face of each end cover, and theconvex faces are kept in c