Power amplifier board with good heat dissipation effect

The utility model discloses a power amplifier board with a good heat dissipation effect. The device comprises a first supporting plate and a second supporting plate, buffering blocks are arranged on one side of the first supporting plate and one side of the second supporting plate correspondingly. T...

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Bibliographic Details
Main Author LIANG NIANZHONG
Format Patent
LanguageChinese
English
Published 21.02.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a power amplifier board with a good heat dissipation effect. The device comprises a first supporting plate and a second supporting plate, buffering blocks are arranged on one side of the first supporting plate and one side of the second supporting plate correspondingly. The opposite sides of the two buffer blocks are connected with the same mounting shell in a clamped mode. Uniformly distributed energy absorption strips are arranged on the outer wall of the top of the mounting shell; a heat conduction plate is arranged at the top of the energy absorption strip, a power amplifier board body is arranged at the top of the heat conduction plate, heat conduction pieces which are evenly distributed are arranged at the bottom of the heat conduction plate, the bottoms of the heat conduction pieces extend into the installation shell, and heat dissipation rods which are evenly distributed are inserted into the outer wall of the bottom of the installation shell. According to the utility model
Bibliography:Application Number: CN201920878592U