Wafer clamping mechanism and wafer edge washing device

According to the wafer clamping mechanism and the wafer edge washing device provided by the utility model, the wafer is fixed in a manner that the wafer is clamped by the upper and lower supporting pins, so that the fixing manner of the wafer in the edge washing process is improved, the wafer is pre...

Full description

Saved in:
Bibliographic Details
Main Authors WU LONGJIANG, YAN SHUAICHEN, LIN ZONGXIAN, XUE CHAO, WU XIAOZHE, CHANG CHUANDONG
Format Patent
LanguageChinese
English
Published 06.12.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:According to the wafer clamping mechanism and the wafer edge washing device provided by the utility model, the wafer is fixed in a manner that the wafer is clamped by the upper and lower supporting pins, so that the fixing manner of the wafer in the edge washing process is improved, the wafer is prevented from being thrown off in high-speed rotation, the wafer is prevented from shaking in the edgewashing process, the edge washing is more uniform, and the yield is improved. 本实用新型提供一种晶圆夹持机构及晶圆洗边装置，采用上下双层撑销夹持晶圆的方式固定晶圆，改善了晶圆在洗边工艺中的固定方式，确保晶圆在高速旋转中不会甩脱，使晶圆在洗边过程中没有抖动现象，洗边更均匀，提高良率。
Bibliography:Application Number: CN201920221123U