Automatic feeding mechanism for reflow soldering

The utility model discloses an automatic feeding mechanism for reflow soldering. The device comprises a substrate conveying part, a first grabbing part, a backflow plate clamping part, a copper frameconveying part, a steel sheet conveying part and a second grabbing part, wherein the substrate convey...

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Bibliographic Details
Main Author JI ZHENGLEI
Format Patent
LanguageChinese
English
Published 22.11.2019
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The utility model discloses an automatic feeding mechanism for reflow soldering. The device comprises a substrate conveying part, a first grabbing part, a backflow plate clamping part, a copper frameconveying part, a steel sheet conveying part and a second grabbing part, wherein the substrate conveying part is used for conveying a ceramic substrate; the reflowing plate clamping part is used for clamping a reflowing plate; the first grabbing part is used for grabbing the ceramic substrate and transferring the ceramic substrate to the backflow plate; the copper frame conveying part is used forconveying a copper frame, the steel sheet conveying part is used for conveying a steel sheet, the second grabbing part is used for grabbing a backflow plate and placing the backflow plate on the backflow plate clamping part, and the second grabbing part is further used for grabbing the copper frame and the steel sheet and placing the copper frame and the steel sheet on the backflow plate. According to the automatic feeding
Bibliography:Application Number: CN201822258109U