PCB film alignment exposure device
The embodiment of the utility model discloses a PCB (printed circuit board) film alignment exposure device, which comprises a B-side film, a T-side film, a positioning base, an edge strip, a film fixing clamp and a plurality of positioning nails, and is characterized in that an alignment hole is for...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
12.11.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The embodiment of the utility model discloses a PCB (printed circuit board) film alignment exposure device, which comprises a B-side film, a T-side film, a positioning base, an edge strip, a film fixing clamp and a plurality of positioning nails, and is characterized in that an alignment hole is formed in the positioning base and is a through hole which is through up and down; nail hanging holes corresponding to the alignment holes in position are formed in the non-pattern areas on one sides of the B-side film and the T-side film; the edgings are bonded with the non-pattern areas on the othersides of the B-side film and the T-side film; the positioning base is arranged between the non-pattern area on one side of the B-side film and the non-pattern area on one side of the T-side film through positioning nails; the film fixing clamps are clamped on the sides, corresponding to the edgings, of the B-side film and the T-side film; and a plurality of film alignment PADs are arranged in thepattern areas of the B-sid |
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Bibliography: | Application Number: CN201920557402U |