Double-sided water-cooling heat dissipation packaging structure of high-power-density IGBT module

• Main Authors: CHEN ZHENHAI, ZHANG JUNWU, ZHANG YANFEI, NING RENXIA, BAO JIE, ZHAO HAO, ZHOU BIN, XU YUAN
• Format: Patent
• Language: Chinese; English
• Published: 15.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a double-sided water-cooling heat dissipation packaging structure of a high-power-density IGBT module. The structure comprises IGBT subunits, diode subunits, a copper-cladceramic substrate, a buffer gasket, a solder layer, a heat conduction silicone grease layer, a graphene heat dissipation layer, an upper water-cooling plate radiator and a lower water-cooling plate radiator. The graphene heat dissipation layer uses the surface of the chip transferred to a designated position as a rapid transverse heat dissipation layer, and rapidly and transversely spreads out local heat of the chip, thereby realizing rapid cooling of local hot spots. The utility model has the advantages of simple manufacture and high flexibility, and can effectively alleviate the non-uniformheat dissipation of the water-cooling radiator, thereby improving the reliability and service life of the device. 本实用新型涉及一种高功率密度IGBT模块的双面水冷散热封装结构，该结构包括IGBT子单元、二极管子单元、覆铜陶瓷基板、缓冲垫片、焊料层、导热硅脂层、石墨烯散热层以及上下水冷板散热器。所述的石墨烯散热层将转移至指定位置的芯片