DIP packaging structure

• Main Authors: ZHENG SHILEI, LUO LIANG, ZHENG ZHENJUN, LIU WEIWEI, SUN XIANGXIANG, JIN QIONGJIE
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a DIP packaging structure. The packaging structure comprises a main plastic packaging layer, heat conduction pins, bonding wires, pins, a chip and base islands, an auxiliary plastic package layer is connected to the exterior of the main plastic package layer; the auxiliary plastic package layer is internally provided with pins, the top ends of the pins are connected with a chip arranged on the base island through bonding wires, the bottom of the base island is arranged at the bottom end of the interior of the main plastic package layer, the outer side of the main plastic package layer is connected with a fixing rod, a moving rod is clamped in the fixing rod, and heat dissipation holes are formed in the cooling fins. The utility model discloses a DIP packaging structure and a manufacturing method thereof. According to the DIP packaging structure, the span of the pins can be well and accurately adjusted by a worker, so that the pins cannot be seriously damagedin the welding and clamp