General test mold for circuit board
The utility model discloses a universal test die for a circuit board. Bottom plate, a first clamping plate is arranged at the upper left end of the bottom plate. A second fixing plate is arranged at the upper end of the bottom plate; the outer side of the second fixing plate is fixedly connected wit...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
13.09.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a universal test die for a circuit board. Bottom plate, a first clamping plate is arranged at the upper left end of the bottom plate. A second fixing plate is arranged at the upper end of the bottom plate; the outer side of the second fixing plate is fixedly connected with a third sliding rod. The outer side of the third sliding rod is slidably connected with a second clamping plate. Clamping grooves are formed in the upper ends of the first clamping plate and the second clamping plate; a threaded protrusion is arranged on the outer side of the left end of the thirdsliding rod. The left end of the third sliding rod is in threaded connection with a travel nut; the outer side of the third sliding rod is sleeved with a second spring. The utility model discloses auniversal test die for a circuit board. The arranged clamping plates can clamp the two sides of the circuit board and cannot make contact with the upper surface of the circuit board, electronic elements on the surface of the c |
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Bibliography: | Application Number: CN201821787700U |