SiC power module packaging structure with good heat dissipation performance

• Main Authors: GAN KUN, LI XIAOBO, TANG JINGTING, YUAN FENGPO, BAI XINJIAO, ZHANG KE
• Format: Patent
• Language: Chinese; English
• Published: 26.07.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a SiC power module packaging structure with good heat dissipation performance. Power module technology field, the DBC heat dissipation structure comprises a lower DBC substrate and an upper DBC substrate which are fixed on a bottom plate, and further comprises a heat dissipation plate and heat dissipation fins, a set of long strip holes are formed in the heat dissipation plate in the width direction, the length direction of the long strip holes is the same as that of the heat dissipation plate, each chipset is located between every two adjacent long strip holes, andthe long strip holes are filled with heat conduction silicone grease layers; the cooling fin comprises a metal net frame and a set of heat conduction pipes. The metal net frame is fixedly connected with the heat dissipation plate, hollow fins are arranged at the positions, corresponding to the heat conduction pipes, of the upper end face of the metal net frame, the hollow fins are fixedly connected with the heat conducti