Flip chip packaging structure

• Main Authors: FU ZHIHUANG, YAN JIANJIAN, WEN XIAOBIN
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a flip chip packaging structure, including support and face down chip, the support includes first electrode, second electrode, the third electrode, fourth electrode and the 5th electrode, first electrode and the 5th electrode set up respectively in alternate segregation between the both sides of the third electrode and the three, the second electrode set up in betweenfirst electrode and the third electrode and with first electrode and the third electrode alternate segregation, the fourth electrode set up in between the 5th electrode and the third electrode and with the 5th electrode and the third electrode alternate segregation, first electrode and the 5th electrode all include the triplex, are being close to the first portion and the third part of the third electrode respectively, are close to the second portion of second electrode. The utility model discloses set up one kind and be applicable to that multiple face down chip establishes ties or support and a face down chip who se