Polishing mould that oxygen -free copper wire wire drawing was used

• Main Author: YANG MINGQIN
• Format: Patent
• Language: Chinese; English
• Published: 18.01.2019
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The utility model belongs to the technical field of wire drawing mould technique and specifically relates to a polishing mould that oxygen -free copper wire wire drawing was used can improve oxygen -free copper wire's line footpath order of accuracy and surface brightness, still has simple structure, convenient to use's characteristics. The utility model discloses a technique purpose is such realization: a polishing mould that oxygen -free copper wire wire drawing was used which characterized in that: including an outer cover die and an interior cover die, outer cover die is the tubulose, andits hole is the bell mouth, and the outer wall of interior cover die suits for the conical surface and with the hole of outer cover die, and first horn mouth has been offered to the main aspects of interior cover die, and the second horn mouth has been offered to the tip, offers the through -hole that polishes usefulness between first horn mouth and the second horn mouth, oxygen -free copper wirepenetrates from the hole m