Packaging structure of miniature LED display module

• Main Author: YAN CHUNWEI
• Format: Patent
• Language: Chinese; English
• Published: 30.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a packaging structure of miniature LED display module, the electronic control apparatus comprises a circuit board, a plurality of luminescence units and transparent encapsulating layer, the luminescence unit includes the blue optical chip of first flip -chip, invert the blue optical chip of green optical chip and second flip -chip, the blue optical chip of first flip -chip, invert green optical chip, the second flip -chip blue optical chip fix in proper order on the circuit board, between luminescence unit and the luminescence unit, between blue optical chip of first flip -chip and the green optical chip of flip -chip, all fill with the filling layer in the clearance of inverting between the blue optical chip of green optical chip and second flip -chip, blue optical chip of first flip -chip or the blue optical chip of second flip -chip go up the coating has the red fluorescence layer, transparent encapsulating wraps up on the layer in the surface of whole circuit board and luminesc