Chip package forming module of thing networking

• Main Author: XIANG SHIHAI
• Format: Patent
• Language: Chinese; English
• Published: 07.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a chip package forming module of thing networking, the sensor unit who has different functions including base plate, component and a plurality of, the component install in on the base plate, a plurality of installation slots have on the base plate, a plurality of sensor unit install in the installation slot of base plate. The utility model provides a chip package formingmodule of thing networking, it is integrated on a chip with a plurality of sensor unit, the realization in with prior art the chip of different functions integrate in an electron constructs the dress, and space is saved, reduces energy consumption an, it uses to save the resource, and can develop the application many times, the user is expand as required, in sensor unit installation slot, so onlyneed this module, the terminating machine is inserted the power promptly and just can directly be used, low cost, the space is little, high reliability. 本实用新型提供了种物联网的芯片封装成型模块，包括基板、元件以及若干个具有不同功能的传感器单元，所述元件安装于所述基板上，所述基板上具有多个安装插