Stable form surface -mounted diode

• Main Authors: CAI HOUJUN, ZHOU DONGFANG, MAO JINA, LI LONGRONG, GUO YAN, ZHANG JING
• Format: Patent
• Language: Chinese; English
• Published: 26.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model relates to a diode field especially relates to stable form surface -mounted diode, include the chip, be located the first pin and the second pin at chip both ends, still include to encapsulate in the outside packaging structure of chip, first pin and second pin, the packaging structure outside is all stretched out to the one end of first pin and second pin, first pin includes first welding section and the first terminal section, and the end that the first terminal section deviates from first welding section one side is equipped with first welded plate, and the packaging structure outside is stretched out to the first terminal section, the second pin includes second welding section and second terminal section, and the end that second terminal section deviates from second welding section one side is equipped with the second welded plate, and the packaging structure outside is stretched out to second terminal section. The utility model discloses stability, pin and external welding stability are