A FPC for installing earphone socket

• Main Authors: ZHANG YUCAI, CHEN LUSHENG, CHEN QING, WANG BUGAO, XIAO YINGSHAN, ZENG MINGTONG, YANG HONGBO, CHEN DIDI, LIU ZHAOPING, XU HUI, WANG GANG, YANG TAO, LI JIYONG, DENG FAMING, LIU ZHAOYONG, ZHAO HONGWU
• Format: Patent
• Language: Chinese; English
• Published: 08.06.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a FPC for installing earphone socket, the substrate conducting hole has been seted up on FPC's the substrate, the fixed front circuit pad that is provided with on the positive substrate of substrate conducting hole, circuit pad outside cover the in front has the positive membrane that covers, the fixed reverse side circuit pad that is provided with on the substrate at the substrate conducting hole back, the outside cover of reverse side circuit pad has the reverse side to cover the membrane, openly it lives front circuit pad to cover the film pressure, the reverse side covers the film pressure and lives reverse side circuit pad, the edge that openly covers membrane and reverse side cover membrane staggers each other. The utility model discloses simple structure,processing convenience, the accessible the utility model discloses a bad phenomenon is beaten to structure prevention earphone socket. 本实用新型公开种用于安装耳机插座的FPC，FPC的基材上开设有基材导通孔，基材导通孔正面的基材上固定设置有正面线路焊盘，正面线路焊盘外部覆盖有正面覆盖膜，基材导通孔背面的基材上固