Pottery CSP package substrate structure

• Main Authors: ZHANG ZHONGYUN, JIANG YANGANG, ZHANG ZHENG, LIU CHANGSHUN, LIU SHAOKAN
• Format: Patent
• Language: Chinese; English
• Published: 27.04.2018
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The utility model relates to a pottery CSP package substrate structure, including the first line layer, intermediate level and the second line layer, the the first line layer includes first base plate, be equipped with a plurality of first through -holes on the first base plate, the intermediate level includes the second base plate, be equipped with a plurality of second through -holes on the second base plate, the the second line layer includes the third base plate, set up in signal disc and shielding piece on the third base plate, be equipped with a plurality of third through -holes on the third base plate, the third through -hole with the second through -hole is dislocation set. Above -mentioned pottery CSP package substrate structure, first through -hole, second through -hole are dislocation set with the third through -hole, can prevent welding hourglass tin, guarantee welded gas tightness and stability, the signal disc adopts three polarity settings, can be applicable to differential signal transmission