Many function chip invert potted element

• Main Authors: WANG JIANGUO, SHEN YAQI
• Format: Patent
• Language: Chinese; English
• Published: 30.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a many function chip invert potted element, including the base plate, at least one wafer has set firmly on the base plate, wafer adopts the flip -chip form, the base platewith wafer produces the interval and forms and hold the cavity of circuit, which comprises a substrate, still be equipped with two at least elastic resin walls between the upper surface of base plate,the both ends of elastic resin wall with wafer's lower surface with the upper surface of base plate is all hugged closely, and encloses to major general's bump and establish in it. The utility modeldiscloses technical scheme's advantage mainly embodies: two elastic resin wall isolation structures, whole sealing performance is better, and core cavity region receives the probability of pollution littleer, makes the overall arrangement of flip -chip solder joint nimble, and convenient wiring is favorable to the design of chip, reduces the interference between the multicore piece, improves the high -frequency characterist