SMD metal package tuning fork crystal
The utility model provides a SMD metal package tuning fork crystal, it is including rectangular base plate, base plate length direction both sides are equipped with recessed wafer groove, the embeddedwafer that is equipped with of wafer groove, the base plate both ends are equipped with the electrod...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
05.01.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides a SMD metal package tuning fork crystal, it is including rectangular base plate, base plate length direction both sides are equipped with recessed wafer groove, the embeddedwafer that is equipped with of wafer groove, the base plate both ends are equipped with the electrode, be equipped with recessed ladder groove on the base plate between electrode and the wafer, the ladder inslot is equipped with bonding conductor, bonding conductor one end is connected with the electrode, the other end is connected with corresponding wafer one end, wafer after the installation, the bonding conductor surface is located same horizontal plane with the substrate surface, the substrate surface is equipped with the apron, the apron is detained at the wafer, the bonding conductor top, it is sealed through resistance weld between apron edge and the base plate, the base plate bottom is equipped with the becket of square frame shape, the base plate corner is equipped with the arc orientation angle of inden |
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Bibliography: | Application Number: CN20172661227U |