Chip package pre -compaction device

The utility model relates to a chip package pre -compaction device, including the bottom plate, the bottom plate has from left to right set gradually spout, right branch fagging and support column, be provided with the traveller in the spout, fixedly connected with left support plate on the travelle...

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Bibliographic Details
Main Author DENG YUNWEI
Format Patent
LanguageChinese
English
Published 20.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model relates to a chip package pre -compaction device, including the bottom plate, the bottom plate has from left to right set gradually spout, right branch fagging and support column, be provided with the traveller in the spout, fixedly connected with left support plate on the traveller, be equipped with a plurality of entrys on the right branch fagging, all block in these entrys and go into to have the plunger, the equal fixedly connected with connecting rod in plunger left side, the fixed pre -compaction ball that is equipped with of connecting rod left end, plunger right -hand member fixedly connected with arm -tie, arm -tie right side fixedly connected with U type support, U type support right side fixedly connected with telescopic link, the left support plate left and right sides is equipped with respectively deposits chamber and loading board, it is equipped with a plurality of division boards in the chamber to deposit, support column upper portion is equipped with the hydraulic press, and
Bibliography:Application Number: CN20172296301U