Substrate processing system

The utility model relates to a substrate processing system, substrate processing system includes: grinding portion, it carries out chemical mechanical polishing (CMP) technology to the base plate, the cleaning part, its base plate to accomplishing lapping process washs, base plate horizontal conveyi...

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Bibliographic Details
Main Authors NOH JIN-SUNG, AN JUN-HO
Format Patent
LanguageChinese
English
Published 03.10.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model relates to a substrate processing system, substrate processing system includes: grinding portion, it carries out chemical mechanical polishing (CMP) technology to the base plate, the cleaning part, its base plate to accomplishing lapping process washs, base plate horizontal conveying section, it is transferred to the cleaning part before grinding into the base plate of the portion of pusing forward into removing to the base plate removing in grinding portion, and the base plate was at first prepared to wash (primary cleaning) at the cleaning part and is later got into to grinding portion before carrying out lapping process, and available effect lies in from this, carries out the first separation to the foreign matter that is present in the base plate before the lapping process who carries out the base plate to improve the grinding efficiency and cleaning efficiency. 本实用新型涉及种基板处理系统，基板处理系统包括：研磨部，其对基板进行化学机械研磨(CMP)工艺；清洗部，其对完成研磨工艺的基板进行清洗；基板移送部，其在研磨部对搬入至基板搬入搬出部的基板进行研磨之前移送至清洗部，基板在进行研磨工艺之前，在清洗部首先进行准
Bibliography:Application Number: CN201621102136U