Heat shield element and have this heat shield element's portable electronic device

The utility model discloses a heat shield element is applied to portable electronic device, heat shield element locates between electronic components and portable electronic device's on the portable electronic device circuit board the casing, is used for the separation electronic components...

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Bibliographic Details
Main Authors GUO HUIQI, QIN XILI
Format Patent
LanguageChinese
English
Published 26.09.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a heat shield element is applied to portable electronic device, heat shield element locates between electronic components and portable electronic device's on the portable electronic device circuit board the casing, is used for the separation electronic components's heat transfer extremely the casing. Wherein the heat shield element surface is formed with a plurality of trompils. The utility model discloses realize the normal radiating while of electronic components, solving the problem that the portable electronic device casing takes place local overheat. 本实用新型公开了种隔热元件，应用于可携式电子装置中，所述隔热元件设于可携式电子装置电路板上的电子元器件和可携式电子装置的壳体之间，用于阻隔所述电子元器件的热量传递至所述壳体。其中所述隔热元件表面形成有多个开孔。本实用新型在实现电子元器件正常散热的同时，解决了可携式电子装置壳体发生局部过热的问题。
Bibliography:Application Number: CN201621206191U