Furthermore

• Main Authors: XIE ZONGXIAN, LIU YAN, FAN KAILIANG, LIU CHUANBIAO, LIU XIAOFENG
• Format: Patent
• Language: Chinese; English
• Published: 19.09.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a furthermore, , includes metal support and this metal support's of parcel cup cover, the metal pin -attached of metal support in embedding cup cover, set up in the cup cover in the part at metal pin -attached top is for reflecting the cup, the reflection cup is equipped with a cavity inner chamber, metal pin -attached is located the part of the bottom surface of cavity inner chamber is the pad, the pad divides solid crystal bonding pad and bonding wire pad into by insulating river course, solid crystal bonding pad's shape is by being located its both sides the river course is injectd, the width at solid crystal bonding pad's middle part is less than the width at its both ends. The utility model discloses a setting up a shape and for the middle wide solid crystal bonding pad in narrow both ends, making the great chip of volume fix in a flexible way and serve at solid crystal bonding pad's arbitrary, the position of each LED chip can be according to the adjustment of production needs